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Engineering Capabilities

Floor-level expertise across the full hardware and test stack — from component selection to system-level validation.

Full PCBA process engineering from solder paste print through final post-reflow inspection — with inline SPI, dual-side AOI, BGA X-Ray, ICT, and FCT integration.

Solder paste printer → SPI 3D inspection → High-speed placement → Flexible placement
Pre-reflow AOI → Reflow oven profiling (SAC305, low-temp alloys) → Post-reflow AOI → X-Ray (BGA, QFN)
Stencil design: aperture ratio, step stencil, Type 4/5 paste for fine-pitch components
Reflow profile optimization: ΔT control, TAL, peak temperature, voiding targets
ICT: in-circuit test for shorts, opens, component values, power rail verification
FCT: boot, comms, I/O verification, firmware flash, version lock
Wave solder, selective solder (Pillarhouse Jade, Ersa VERSAFLOW), PTH hand solder
Conformal coating: Nordson Select, Asymtek — masking, cure, thickness validation

Production Equipment

Fuji NXT III / Yamaha YSM20R / ASM SIPLACE SX
Heller 1500EXL / Vitronics XPM series reflow
Koh Young KY8030-3D SPI
Koh Young Zenith / Saki 3Xi-M110 AOI
Viscom S3088 / Nordson DAGE XD7600NT X-Ray
Keysight i3070 / Teradyne TestStation ICT

Conducted parametric RF test, OTA chamber measurements, per-unit production-line RF calibration, and protocol stack validation using industry-standard signaling testers.

Conducted RF: Tx power, Rx sensitivity, EVM, ACLR, harmonics, spurious emissions
OTA: TRP, TIS, MIMO OTA throughput, beam pattern (ETS-Lindgren, Satimo chambers)
Per-unit PA calibration, frequency offset correction, cal data NVM/flash write on production line
Protocol stack test: LTE/5G NR attach, data throughput, handover, BLER
Antenna characterization: S-parameters, impedance matching, radiation efficiency (VNA)
Pre-compliance EMC scanning: radiated and conducted emissions, pre-scan strategy
RF subsystem: PA, LNA, filter, duplexer, switch selection and integration
CBRS, Band 14, DSRC/C-V2X, mmWave 5G (FR2) test methodology

RF Test Equipment

R&S CMX500 / CMW500 — 5G NR / LTE protocol & RF
Anritsu MT8000A — 5G NR signaling tester
Keysight UXA/PXA signal analyzers
Keysight E8267D PSG signal generators
Keysight E5063A VNA — antenna & filter
Spirent / Ixia — network & protocol layer
ETS-Lindgren / Satimo OTA chambers

Sub-assembly, mechanical assembly, and full system-level test (SLT) — including IP-rating validation, thermal soak, and OTA final validation sampling.

Torque-controlled fastener assembly with in-house designed jigs and fixtures
Cable harness routing, connector seating verification, pull test
TIM application control: volume, placement, compression verification
IP6x leak test: gasket inspection, torque sequence, pressure/vacuum test
SLT: system power-on, network attach, application layer functional test
Thermal soak: temperature cycling under load, thermal shutdown validation
Firmware flash, version verification, unit serialization and lock
AQL cosmetic inspection, label verification, IMEI/MAC database match
Packaging line: inner box, foam/tray insert, accessory kitting, carton labeling
FG inspection: AQL Level II sampling, PSI, packing list verification, COC issuance

Assembly & Test Infrastructure

Custom test fixtures and jigs (in-house)
Torque-controlled ESD-safe assembly tooling
IP-rating pressure / vacuum test stations
Thermal cycling chambers for ESS / burn-in
OTA final validation — conducted and radiated
MES / barcode / 2D matrix traceability integration

ISO 9001-aligned quality systems with real-time SPC, OEE dashboards, DPMO trending, and structured corrective action from production floor through finished goods.

FPY tracking by process step: SMT, ICT, FCT, SLT, Final QA
DPMO: defects per million by defect category and process step
SPC: Cpk ≥ 1.67 for CTQ parameters — paste volume, placement offset, reflow ΔT, RF Tx power
OEE = Availability × Performance × Quality — line loss analysis and Pareto
8D / 5-Why / Fishbone structured root cause and corrective action
SCAR / NCR / CAPA documentation compliant with ISO 9001 / IATF 16949
AQL incoming, in-process, and final QA sampling plan management
Scrap/rework authorization, rework log, re-test protocol, scrap cost tracking

Quality & Analysis Tools

Minitab — SPC, Gauge R&R, capability studies
Python (pandas, scipy, matplotlib, seaborn)
SAP ME / Aegis FactoryLogix / Valor MES
Arena / Agile / Windchill PLM
Jira / Smartsheet / MS Project
SAP / NetSuite ERP

Hands-on with the full suite of production and development test instrumentation — from board bring-up to system validation, and from conducted RF to full OTA.

Keysight Infiniium / Tektronix MSO oscilloscopes — board debug, signal integrity
Keysight E5063A VNA — antenna S-parameter and impedance matching
Keysight UXA/PXA + E8267D PSG — RF parametric, spurious, EVM
R&S CMX500 / CMW500 — 5G NR and LTE protocol and RF test
Anritsu MT8000A — 5G NR and LTE-A signaling tester
Spirent / Ixia — network throughput and protocol layer
ADS (Keysight) / HFSS (Ansys) — RF simulation and EM modeling
JTAG / boundary scan — hardware bring-up and debug

Software & Simulation

Keysight ADS — RF / MW circuit simulation
Ansys HFSS — EM / antenna simulation
Python — yield, OEE, SPC automation
Minitab — statistical process control
JTAG / OpenOCD / Lauterbach — HW debug
Altium / Cadence — schematic & layout review

KPIs We Track

Every metric tied directly to cost, quality, and time-to-market.

FPY
First Pass Yield
Tracked per process step: SMT, ICT, FCT, SLT, Final QA. Root cause discipline at every gate.
OEE
Equipment Effectiveness
Availability × Performance × Quality — line loss Pareto and corrective action loop.
Cpk≥1.67
Process Capability
SPC for paste volume, placement offset, reflow ΔT, RF Tx power, and ICT defects.
DPMO
Defects Per Million
Trended by defect category with 8D/5-Why corrective action discipline at every escape.
PPM
Field Escape Rate
DOA rate, warranty claim rate, and field return tracking tied back to production data.
OTD
On-Time Delivery
Supplier and CM OTD governance with PPV tracking and inventory turns reporting.